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2.5 Fabrication Results
The fabrication process outlined in Table 1 was attempted with two sets of SOI wafers. Some difficulties were encountered during this first fabrication run. Because of poor bond quality, both wafer stacks partially delaminated during DRIE of the cap layer (step 5). However, successful fabrication of an out-of-plane joint was achieved. A micrograph of this joint is shown in Figure 12. The placement of this joint indicates an alignment error of less than 10 mm. Figure 13 shows a photograph of the same joint along with the site of an out-of-plane joint that did not bond. Possible reasons for the poor bond quality are discussed in the next section.
Figure 12. Micrograph of fabricated 2 mm out-of-plane joint.
Figure 13. Photograph of successful and unsuccessful out-of-plane joint bonds.
