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2.7 Summary
The novel 3DMEMS process has been introduced and described. This process was developed to create 3-D devices through a combination of DRIE, SOI wafer bonding, and HF etching. To reduce the number of alignment and bonding steps, only two SOI wafers are employed. Compliant beams are employed as an alternative to true revolute joints.
A fabrication run was attempted with two sets of wafers. Although the process could not be completed due to a problem with wafer bonding, an out-of-plane joint was successfully fabricated. Additionally, a wafer-to-wafer alignment error of less than 10 mm was demonstrated. Areas of process improvement have been identified to promote successful wafer bonding in subsequent fabrication runs.